TW281786B - - Google Patents

Info

Publication number
TW281786B
TW281786B TW083104759A TW83104759A TW281786B TW 281786 B TW281786 B TW 281786B TW 083104759 A TW083104759 A TW 083104759A TW 83104759 A TW83104759 A TW 83104759A TW 281786 B TW281786 B TW 281786B
Authority
TW
Taiwan
Application number
TW083104759A
Other languages
Chinese (zh)
Original Assignee
Handotai Energy Kenkyusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Handotai Energy Kenkyusho Kk filed Critical Handotai Energy Kenkyusho Kk
Application granted granted Critical
Publication of TW281786B publication Critical patent/TW281786B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
TW083104759A 1993-05-26 1994-05-25 TW281786B (en])

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14700193 1993-05-26

Publications (1)

Publication Number Publication Date
TW281786B true TW281786B (en]) 1996-07-21

Family

ID=15420338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083104759A TW281786B (en]) 1993-05-26 1994-05-25

Country Status (3)

Country Link
KR (1) KR0180573B1 (en])
CN (4) CN100501980C (en])
TW (1) TW281786B (en])

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW451284B (en) 1996-10-15 2001-08-21 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
TWI282126B (en) * 2001-08-30 2007-06-01 Semiconductor Energy Lab Method for manufacturing semiconductor device
JP3992976B2 (ja) * 2001-12-21 2007-10-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
DE10217876A1 (de) * 2002-04-22 2003-11-06 Infineon Technologies Ag Verfahren zur Herstellung dünner metallhaltiger Schichten mit geringem elektrischen Widerstand
CN100347820C (zh) * 2002-05-22 2007-11-07 统宝香港控股有限公司 有源矩阵显示器件及其制作
JP2004363241A (ja) * 2003-06-03 2004-12-24 Advanced Lcd Technologies Development Center Co Ltd 結晶化半導体層の形成方法及び形成装置ならびに半導体装置の製造方法
KR100514181B1 (ko) 2003-09-03 2005-09-13 삼성에스디아이 주식회사 시리즈 박막트랜지스터, 그를 이용한 능동 매트릭스유기전계발광소자 및 상기 능동 매트릭스유기전계발광소자의 제조방법
CN101140940A (zh) * 2006-08-18 2008-03-12 株式会社液晶先端技术开发中心 电子装置、显示装置、接口电路和差分放大装置
CN101419986B (zh) * 2008-12-05 2011-05-11 北京时代民芯科技有限公司 一种防边缘漏电的双边缘抗总剂量辐射加固版图结构
TWI543358B (zh) * 2014-01-13 2016-07-21 友達光電股份有限公司 顯示面板的畫素

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162224A (en) * 1979-06-06 1980-12-17 Toshiba Corp Preparation of semiconductor device
US4727044A (en) * 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
EP0178447B1 (en) * 1984-10-09 1993-02-17 Fujitsu Limited A manufacturing method of an integrated circuit based on semiconductor-on-insulator technology
JPS61102628A (ja) * 1984-10-25 1986-05-21 Sony Corp 液晶表示装置
JP2655865B2 (ja) * 1988-03-16 1997-09-24 株式会社日立製作所 液晶表示装置の製造方法
JP2653099B2 (ja) * 1988-05-17 1997-09-10 セイコーエプソン株式会社 アクティブマトリクスパネル,投写型表示装置及びビューファインダー
JPH0227320A (ja) * 1988-07-18 1990-01-30 Hitachi Ltd 薄膜半導体表示装置とその製造方法
JPH0252419A (ja) * 1988-08-16 1990-02-22 Sony Corp 半導体基板の製造方法
US5147826A (en) * 1990-08-06 1992-09-15 The Pennsylvania Research Corporation Low temperature crystallization and pattering of amorphous silicon films

Also Published As

Publication number Publication date
CN100501980C (zh) 2009-06-17
CN1058584C (zh) 2000-11-15
CN100350627C (zh) 2007-11-21
KR940027187A (ko) 1994-12-10
KR0180573B1 (ko) 1999-03-20
CN1101167A (zh) 1995-04-05
CN100379017C (zh) 2008-04-02
CN1258102A (zh) 2000-06-28
CN1258104A (zh) 2000-06-28
CN1881568A (zh) 2006-12-20

Similar Documents

Publication Publication Date Title
FR2703947B1 (en])
TW283776B (en])
TW288107B (en])
FR2704266B1 (en])
FR04C0020I1 (en])
EP0712290A4 (en])
FR2705941B1 (en])
FR2701905B1 (en])
FR2701701B1 (en])
DK2193D0 (en])
TW281786B (en])
EP0643239A3 (en])
FR2706591B1 (en])
FR2706598B1 (en])
EP0710070A4 (en])
FR2704988B1 (en])
FR2706765B3 (en])
ES1024806Y (en])
FR2706795B3 (en])
IN183087B (en])
TW254010B (en])
IN179140B (en])
IN187426B (en])
IN187325B (en])
ECSMU930014U (en])

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees